FORMMEDIUM SIGNALFINANCIAL10-K

FormFactor significantly increased capital expenditures by 170% to $103.7M while cash declined 46% and profitability decreased, suggesting major capacity investments during a challenging operating period.

The dramatic increase in capex combined with declining cash and profits indicates FormFactor is making substantial growth investments while facing near-term headwinds. This could position the company well for future demand but creates execution risk and cash flow pressure in the interim.

Comparing 2026-02-20 vs 2025-02-21View on EDGAR →
FINANCIAL ANALYSIS

FormFactor's financials show a company in heavy investment mode with capital expenditures surging 170% to $103.7M, causing cash to drop 46% to $103.3M. Operating performance declined with net income falling 22% to $54.4M and operating income down 12%, while the company reduced share buybacks by 51%. The combination of major capex investments, declining profitability, and reduced cash suggests FormFactor is prioritizing growth capacity over near-term returns, creating both opportunity and execution risk for investors.

FINANCIAL STATEMENT CHANGES
Capital Expenditure
Cash Flow
+169.7%
$38.4M$103.7M

Capital expenditure jumped 169.7% — major investment cycle underway; assess returns on deployment.

Share Buybacks
Cash Flow
-50.8%
$53.3M$26.2M

Buyback activity reduced 50.8% — capital being redeployed elsewhere or cash conservation underway.

Cash & Equivalents
Balance Sheet
-45.8%
$190.7M$103.3M

Cash declined 45.8% — significant cash burn or deployment; verify adequacy of remaining liquidity runway.

Interest Expense
P&L
+24.6%
$418K$521K

Interest costs rose 24.6% — monitor debt levels and coverage ratio in rising rate environment.

Net Income
P&L
-21.9%
$69.6M$54.4M

Net income declined 21.9% — review whether driven by operations, interest costs, or non-recurring items.

Accounts Receivable
Balance Sheet
+20.3%
$104.3M$125.4M

Receivables grew 20.3% — monitor days sales outstanding for collection efficiency.

Operating Income
P&L
-11.9%
$64.8M$57.1M

Operating profitability softening — costs rising faster than revenue, watch for margin recovery plan.

LANGUAGE CHANGES
NEW — 2026-02-20
PRIOR — 2025-02-21
ADDED
Our last three fiscal years ended on December 27, 2025, December 28, 2024 and December 30, 2023.
As of December 27, 2025, we operate in two reportable segments consisting of the Probe Cards segment and the Systems segment.
Our probe cards are customized to our customers unique wafer and chip designs by modifying and adapting our standard product architectures to meet each customer s specific wafer layouts, chip layouts, and electrical test requirements.
For many advanced applications, our products must maintain tens of thousands, and sometimes even hundreds of thousands, of simultaneous high-fidelity low-impedance electrical contacts with the corresponding chip contacts on the wafer.
In addition, for high signal-fidelity devices such as wireless radio frequency transceivers and automotive radar chips, our probe card technologies are capable of testing at millimeter-wave frequencies currently exceeding 80 GHz.
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REMOVED
Our last three fiscal years ended on December 28, 2024, December 30, 2023 and December 31, 2022.
As of December 28, 2024, we operate in two reportable segments consisting of the Probe Cards segment and the Systems segment.
Our probe cards are customized for our customers unique wafer and chip designs by modifying and adapting our standard product architectures to meet an individual customer s specific wafer and chip layouts and electrical test requirements.
We offer probe cards to test a variety of semiconductor device types, including systems on a chip (SoCs), mobile application processors, microprocessors, microcontrollers, graphic processors, network and digital signal processing integrated circuits (ICs), radio frequency amplifiers, filters and antenna in package devices, analog, mixed signal, image sensors, electro-optical, DRAM memory (including high-bandwidth memory, or HBM ), NAND flash memory, NOR flash memory, and quantum computer processor devices.
For many advanced applications, our products must maintain tens of thousands of simultaneous high-fidelity low-impedance electrical contacts with the corresponding chip contacts on the wafer.
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