ADDED
As of December 3, 2025, the registrant had outstandi ng 14,356,797 sha res of Common Stock, $0.01 par value.
BUSINESS OUR COMPANY We provide equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication.
Our products are used to fabricate and package semiconductor devices, such as graphic processing units (GPU s) used in AI applications, silicon carbide (SiC) and silicon (Si) power devices and other optical, analog and digital devices.
We sell these products to semiconductor device packaging, electronic assembly and device fabrication companies worldwide.
Our Thermal Processing Solutions includes conveyorized reflow equipment for advanced semiconductor packaging and electronic assembly, high temperature conveyorized furnaces for power semiconductor substrate and electronic components manufacturing, and diffusion furnaces for (SIC) and (Si) power device production.
Our Semiconductor Fabrication Solutions include consumables, equipment and services for wafer polishing, dicing and cleaning.
Our strategy is to focus our efforts on fully capitalizing on advanced packaging equipment opportunities driven by AI infrastructure investments and expand our consumables and service business for semiconductor fabrication by providing exceptional service and high-quality products to underserved segments of the market.
We categorize each of our subsidiaries into one of two reportable segments, based primarily on the industries they serve: Reportable Segment % of 2025 Consolidated Net Revenue Thermal Processing Solutions 73 % Semiconductor Fabrication Solutions 27 % These reportable segments are comprised of the following four wholly-owned subsidiaries: Thermal Processing Solutions: BTU, a Delaware corporation based in Westford, Massachusetts, with operations in China, Malaysia and the UK, acquired in January 2015.
Semiconductor Fabrication Solutions: PR Hoffman, an Arizona corporation based in Carlisle, Pennsylvania, acquired in July 1997.
Advanced Compound Materials, Inc., a Delaware corporation based in Spartanburg, South Carolina, founded in 2023; Intersurface Dynamics, a Connecticut corporation based in Bethel, Connecticut, acquired in March 2021; and Entrepix, an Arizona corporation based in Phoenix, Arizona, acquired in January 2023.
REMOVED
As of November 29, 2024, the registrant had outstan ding 14,277,066 shares of Common Stock, $0.01 par value.
BUSINESS OUR COMPANY We provide equipment, consumables and services for semiconductor wafer fabrication and device packaging.
Our products are used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon (Si) power devices, digital and analog devices, power electronic packages, advanced semiconductor packages and electronic assemblies.
We sell these products to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe.
Our semiconductor fabrication solutions include consumables, equipment and services for wafer polishing, cleaning, slicing and dicing.
Our thermal processing solutions include reflow equipment for chip packaging and electronic assembly, diffusion furnaces and furnaces used to produce ceramic based power semiconductor packages and passive electronic components.
The focus of our strategy is to expand our consumables and service business for semiconductor wafer fabrication and to capitalize on opportunities for thermal processing equipment in advanced packaging and power electronic applications.
We categorize each of our subsidiaries into one of two reportable segments, based primarily on the industries they serve: Reportable Segment % of 2024 Consolidated Net Revenue Thermal Processing Solutions 68 % Semiconductor Fabrication Solutions 32 % These reportable segments are comprised of the following five wholly-owned subsidiaries: Thermal Processing Solutions (formerly called Semiconductor): BTU, a Delaware corporation based in Westford, Massachusetts, with operations in China, Malaysia and the UK, acquired in January 2015.
Semiconductor Fabrication Solutions (formerly called Material and Substrate): PR Hoffman, an Arizona corporation based in Carlisle, Pennsylvania, acquired in July 1997; Advanced Compound Materials, Inc., a Delaware corporation based in Spartanburg, South Carolina, founded in 2023; Intersurface Dynamics, a Connecticut corporation based in Bethel, Connecticut, acquired in March 2021; and Entrepix, an Arizona corporation based in Phoenix, Arizona, acquired in January 2023.
Amtech is uniquely positioned in that our products are employed throughout the early and late stages of semiconductor and electronics manufacturing.