AMKRMEDIUM SIGNALOPERATIONAL10-K

AMKR significantly expanded its business description to emphasize AI and data center positioning while showing substantial balance sheet growth across key metrics.

The enhanced language positioning Amkor as a leader serving AI, data centers, and advanced computing markets suggests management is capitalizing on semiconductor industry tailwinds. The expanded geographic footprint emphasis and partnership language indicate a more aggressive competitive positioning strategy.

Comparing 2026-02-20 vs 2025-02-21View on EDGAR →
FINANCIAL ANALYSIS

The balance sheet reflects meaningful business expansion with total assets growing 17% to $8.1B, driven by increased inventory (+41%), accounts receivable (+28%), and cash positions (+22%). Total liabilities increased proportionally by 32%, while capital expenditures rose 22% to $905M, indicating sustained investment in capacity expansion. The broad-based growth across working capital components and continued high capex spending signals robust demand and business scaling.

FINANCIAL STATEMENT CHANGES
Inventory
Balance Sheet
+40.8%
$310.9M$437.8M

Inventory surged 40.8% — growing faster than typical sales pace; potential demand softening or supply chain overcorrection.

Total Liabilities
Balance Sheet
+31.5%
$2.8B$3.6B

Liabilities grew 31.5% — significant increase in debt or obligations, assess impact on financial flexibility.

Accounts Receivable
Balance Sheet
+28.4%
$1.1B$1.4B

Receivables grew 28.4% — monitor days sales outstanding for collection efficiency.

Current Assets
Balance Sheet
+26.4%
$3.1B$3.9B

Current assets grew 26.4% — improving short-term liquidity or inventory/receivables build.

Cash & Equivalents
Balance Sheet
+21.6%
$1.1B$1.4B

Cash grew 21.6% — improving liquidity position supports investment and shareholder returns.

Capital Expenditure
Cash Flow
+21.6%
$743.8M$904.6M

Capex increased 21.6% — ongoing investment in capacity or infrastructure for future growth.

Current Liabilities
Balance Sheet
+17.6%
$1.5B$1.7B

Current liabilities rose 17.6% — increased short-term obligations, watch current ratio.

Total Assets
Balance Sheet
+17.2%
$6.9B$8.1B

Asset base grew 17.2% — expansion through organic growth, acquisitions, or capital deployment.

LANGUAGE CHANGES
NEW — 2026-02-20
PRIOR — 2025-02-21
ADDED
headquartered outsourced semiconductor assembly and test service provider ( OSAT ) and is a global leader in outsourced semiconductor packaging and test services.
With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world s leading semiconductor and electronics companies to bring advanced technologies to market.
The company s comprehensive portfolio includes advanced packaging, wafer-level processing and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables.
We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services.
These trends include: Accelerating adoption of artificial intelligence applications by both enterprises and consumers, which has increased demand for computing power at data centers and in edge computing devices such as smartphones, autonomous vehicles and consumer and industrial devices.
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REMOVED
headquartered OSAT (outsourced semiconductor assembly and test) service provider.
Since its founding in 1968, Amkor has pioneered the outsourcing of integrated circuit ( IC ) packaging and test services and is a strategic manufacturing partner for the world s leading semiconductor companies, foundries, and electronics original equipment manufacturers ( OEMs ).
Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables.
Amkor s operational base includes production facilities, research and development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services.
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