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headquartered outsourced semiconductor assembly and test service provider ( OSAT ) and is a global leader in outsourced semiconductor packaging and test services.
With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world s leading semiconductor and electronics companies to bring advanced technologies to market.
The company s comprehensive portfolio includes advanced packaging, wafer-level processing and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables.
We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services.
These trends include: Accelerating adoption of artificial intelligence applications by both enterprises and consumers, which has increased demand for computing power at data centers and in edge computing devices such as smartphones, autonomous vehicles and consumer and industrial devices.
The increased demand for new broadband wired and wireless networking equipment.
The adoption of heterogeneous integration (diverse dies positioned close to each other within the same package) for scaling performance beyond Moore s Law to achieve improved power efficiency, design flexibility and scalability in data center computing, artificial intelligence and similar end uses.
An increase in the semiconductor content within electronic products to provide greater functionality and higher levels of performance.
The continued build out of 5G infrastructure and 5G enabled devices.
STRATEGY AND COMPETITIVE STRENGTHS Amkor s primary financial objective is profitable sales growth.
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headquartered OSAT (outsourced semiconductor assembly and test) service provider.
Since its founding in 1968, Amkor has pioneered the outsourcing of integrated circuit ( IC ) packaging and test services and is a strategic manufacturing partner for the world s leading semiconductor companies, foundries, and electronics original equipment manufacturers ( OEMs ).
Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables.
Amkor s operational base includes production facilities, research and development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services.
These trends include: Adoption of artificial intelligence applications within data centers and edge devices such as smartphones, autonomous vehicles and consumer and industrial devices.
The proliferation of semiconductor devices into well-established end products such as automotive systems for automation and driver assist, electrification and infotainment systems.
An increase in mobility and connectivity capabilities, driving demand for new broadband wired and wireless networking equipment.
The adoption of heterogeneous integration (diverse dies positioned close to each other within the same package) to reduce cost, improve yields and deliver required performance in data center computing, artificial intelligence and similar end uses.
The increase in digital format in our environment, from sensors for automobiles (e.g., pressure, radar, LiDAR and image recognition), mobile devices (e.g., 3D motion, temperature, acceleration and imaging), and IoT (e.g., in-home sensing from temperature to weather and wearables).